A poster for the exhibition. [Photo/Tide News]

The 2026 Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Expo will be held from May 14–16 at the Hangzhou Convention and Exhibition Center, aiming to create a global platform for industry exchange and collaboration.

The expo will cover the full semiconductor value chain, from design and manufacturing to equipment and materials.

Leveraging Hangzhou's position in the Yangtze River Delta region and its strong digital economy base, the event will highlight cutting-edge areas such as AI chips, advanced packaging, Chiplet, and third-generation semiconductors.

The expo will also host multiple industry forums and matchmaking events, including automotive chips, smart manufacturing, and key materials, alongside product launches and demand briefings from sectors such as humanoid robotics, new energy vehicles, and medical technology.

Organizers say the event aims to strengthen supply chain resilience, accelerate tech commercialization, and foster major cooperation deals, positioning Hangzhou as a key hub in global semiconductor collaboration.

The Hangzhou National Xinhuo Platform for Innovation and Entrepreneurship. [Photo/Tide News]